Tag: FABCI IIT Hyderabad

DOT – C DOT grants 7.59 Cr to Silizium Circuits to develope indigenous LEO Satellite Components and GNSS RF Front-End ASIC

In a significant stride towards bolstering India’s indigenous telecommunications capabilities, the Centre for Development of Telematics (C-DOT), the premier R&D center of the Department of Telecommunications (DoT), has entered into an agreement with Silizium Circuits Pvt Ltd. This collaboration focuses on the “Design and Development of LEO Satellite Components and GNSS RF Front-End ASIC.

Silizium Circuits, a fabless semiconductor IP and SoC startup incubated under FABCI at IIT Hyderabad, brings its expertise in analog, RF, and mixed-signal technologies to this initiative. The project is supported by the Telecom Technology Development Fund (TTDF) scheme of the DoT, which aims to fund Indian startups, academia, and R&D institutions in designing and commercializing telecommunication products and solutions.

The agreement was formalized during a ceremony attended by key figures, including Dr. Rajkumar Upadhyay (CEO, C-DOT), Mr. Rijin John (Co-Founder & CEO, Silizium Circuits), Dr. Pankaj Kumar Dalela, Ms. Shikha Srivastava (Directors of C-DOT), and senior officials from DoT, such as Dr. Parag Agarwal (DDG, TTDF) and Shri. Vinod Kumar (DDG, SRI).

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Silizium Circuits Selected for India–Taiwan Semiconductor Exchange Program, Showcases Innovation at SEMICON Taiwan 2024

We’re thrilled to announce that Silizium Circuits has been selected as one of the few Indian semiconductor startups to participate in the India–Taiwan Semiconductor Exchange Program. This recognition marks a significant step forward in our global journey and reflects our commitment to innovation in the fabless semiconductor space. As part of this program, we had the opportunity to showcase our capabilities at SEMICON Taiwan 2024, one of the most influential semiconductor events in Asia. Supported by Taiwan’s National Science and Technology Council (NSTC) and hosted at Taiwan Tech Arena – South (TTA-South) in Tainan, we presented two working chips developed in collaboration with TSMC and outlined our roadmap for advanced analog and RF semiconductor design. The event also enabled us to engage with global industry leaders in areas such as automotive, health tech, AI/ML, navigation, 6G, and Industry 4.0. Our participation reflects not only the progress we’ve made but also the immense potential of cross-border collaboration in building world-class semiconductor solutions. We’re excited about the global relationships and technical opportunities that this program unlocks as we continue developing impactful technologies across GNSS, 5G, and satellite communications.

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